AT&S are experts in high technology PCB processes and embedded component and semiconductor packaging. ECP is our patent protected technology for integrated active semiconductor and passive component packaging offering miniaturization and reliability benefits. Packaging and SiP modules for smartphone, tablet, mobile gaming, medical, power devices, green energy, semiconductor, integrated sensor, battery management, audio module, MEMS packaging applications. Replace QFN, stacked BGA, wire bond, SOIC, QFP, LGA package styles with ECP
